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Kabasph Additive Solutions For Two-Component Epoxy Systems

Kabasph series of additives are specifically developed for two-component epoxy systems and are suitable for applications such as two-component epoxy adhesives, sealants, potting compounds, electronic encapsulation, composites, industrial flooring, civil engineering, and high-performance protective systems. The product range covers five major categories—dispersants, anti-sinking thixotropic agents, wetting and levelling agents, defoamers, and tackifiers—providing a comprehensive additive solution for two-component epoxy formulations. It addresses key challenges including filler and nano-filler dispersion, viscosity reduction at high filler loading, anti-settling and sag control, wetting on oily substrates, levelling, foam control, and adhesion to metal and non-metal surfaces, while maintaining storage stability, curing activity, colour stability, and final film or bond performance.

Two-component epoxy systems are widely used in adhesives, sealants, potting, electronic encapsulation, composites, industrial flooring, civil engineering, and protective applications where high mechanical strength, chemical resistance, and durable adhesion are essential. However, formulating with these systems presents unique challenges: filler and nano-filler dispersion, viscosity control at high filler loading, settling and sagging, wetting on oily or contaminated substrates, levelling, foam generation, colour stability in anhydride-cured systems, compatibility with amine curing agents, and adhesion failure on metal and non-metal surfaces. Additives must be carefully selected to maintain compatibility with both the epoxy resin and the curing agent without adversely affecting curing speed, pot life, storage stability, transparency, colour, or final film properties.

 

Two-component Epoxy System

Application Classification

Model

Product Type

Product Characteristics

Dispersant

KBS-F5000A

Acid polyester compounds

General-purpose cost-effective viscosity reducing dispersant

KBS-F9100

Acid polyester compounds

Highly efficient viscosity reduction with high fillers

KBS-F9100A

Acid polyester compounds

Strong viscosity reduction with high fillers, especially suitable for viscosity reduction of thermally conductive fillers

KBS-F0400

Modified polyester polymers

Dispersion of nano inorganic fillers with excellent stability

KBS-F8600

Acid polyester compounds

High filler strength, excellent stability, colour stability in anhydride cured systems

Anti-sinking Thixotropic Agent

KBS-C410K

Organic polyurea

Low impact on transparency, viscosity, storage stability and curing activity, excellent anti-sinking and thixotropic effect.

KBS-C6100

Modified polyamide solutions

With hydrophilic aerosilicone, improve the thixotropy of epoxy system, does not affect the viscosity of amine curing agent.

KBS-C6200

Modified polyamide solutions

— 

KBS-C3120X

Polyamide wax pastes

Environmentally friendly solvents have excellent anti-sinking and thixotropic effects on high specific gravity fillers, and their unique molecular structure is helpful for bond strength enhancement.

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