Kabasph Additive Solutions For One-Component Epoxy Adhesive

One-component epoxy systems are widely used in coatings, adhesives, sealants, potting, electronic encapsulation, composites, and thermal management applications where single-package handling, storage stability, and reliable curing are essential. However, formulating with these systems presents unique challenges: filler and nano-filler dispersion, viscosity reduction at high filler loading—especially for thermally conductive fillers—settling and sagging during storage and application, insufficient substrate wetting on oily or contaminated surfaces, surface defects such as craters and orange peel, foam generation that compromises film quality, and adhesion failure on metal and non-metal substrates. Additives must be carefully selected to maintain compatibility with the epoxy chemistry without adversely affecting storage stability, curing activity, transparency, colour stability, or final film properties.

Dispersants

• KBS-F5000 is an acid polyester compound dispersant. It is a universal, cost-effective viscosity-reducing dispersant suitable for standard one-component epoxy formulations where reliable pigment and filler dispersion is required.
• KBS-F9100 is an acid polyester compound dispersant designed for highly filled one-component epoxy systems. It provides highly efficient viscosity reduction with high filler loading, helping formulators achieve stable, processable systems without sacrificing filler content.
• KBS-F9100A is an acid polyester compound dispersant offering strong viscosity reduction with high fillers. It is especially suitable for reducing the viscosity of thermally conductive fillers, making it ideal for thermally conductive epoxy systems, electronic potting, and gap-filling applications.
• KBS-F0400 is a modified polyester polymer dispersant. It provides wetting and dispersing of nano-fillers with excellent stability, helping prevent agglomeration and ensuring uniform distribution of nano-scale fillers in one-component epoxy systems.
• KBS-F8600 is an acid polyester compound dispersant. It delivers strong viscosity reduction with high filler strength and excellent stability, making it suitable for highly filled one-component epoxy formulations requiring long-term storage stability.

Anti-sinking Thixotropic Agents

• KBS-C410K is an organic polyurea anti-sinking thixotropic agent. It has low impact on transparency, viscosity, storage stability, and curing activity, while providing excellent anti-sinking and thixotropic effects. It is suitable for one-component epoxy systems requiring reliable rheology control.
• KBS-C3120X is a polyamide wax paste anti-sinking thixotropic agent based on environmentally friendly solvents. It provides excellent anti-sinking and thixotropic effects on high specific gravity fillers. Due to its unique molecular structure, it also helps improve bond strength, making it particularly useful in adhesives and sealants with dense fillers.

Wetting and Levelling Agents

• KBS-L333K is a polyether-modified silicone wetting and levelling agent. It provides excellent wetting and levelling properties and is suitable for a broad range of one-component epoxy coatings and sealants.
• KBS-L331K is a polyether-modified silicone wetting and levelling agent. It delivers excellent wetting and levelling performance combined with foam inhibition, making it useful in systems where surface quality and foam control must be addressed together.
• KBS-L411K is an organosiloxane polymer wetting agent designed for oily substrates. It strongly reduces surface tension and effectively solves the loss of adhesion caused by substrate oil contamination. It is recommended for applications where substrate cleanliness cannot be fully guaranteed.
• KBS-L3580A is a polyacrylate solution levelling agent with good compatibility. It is suitable for improving the levelling of highly transparent systems, especially clear epoxy coatings and transparent sealants where optical clarity is critical.

Defoamers

• KBS-X055K is a polyacrylate non-silicone defoamer. It offers good compatibility and efficient defoaming performance, making it suitable for one-component epoxy systems where silicone-free foam control is preferred.
• KBS-X066K is a fluorine-modified silicone solution defoamer. It provides defoaming performance with a low tendency tœo cause oil floating or surface defects, helping maintain clean and uniform surfaces in demanding epoxy formulations.
• KBS-X6800A is a modified silicone defoamer. It delivers excellent defoaming and foam inhibition performance, making it suitable for one-component epoxy systems requiring rapid and thorough foam elimination.

Tackifiers

KBS-T0200 is an organosilane tackifier containing epoxy groups. It provides excellent adhesion to metallic and non-metallic surfaces, making it suitable for one-component epoxy adhesives, sealants, and coatings where durable bonding to diverse substrates is required.

KBS-T0300A is a polyester compound tackifier. It provides excellent adhesion to metal surfaces with modified flexibility, helping improve bonding performance in one-component epoxy systems where both adhesion and flexibility are required.

Application Areas

One-component epoxy systems are widely used in applications where convenient single-package handling, storage stability, and reliable curing performance are essential. Typical application areas include:

• Coatings — One-component epoxy coatings for industrial maintenance, automotive parts, metal protection, concrete floors, and electronic components. These systems require good pigment and filler dispersion, anti-settling, levelling, and foam control.
• Adhesives and Sealants — One-component epoxy adhesives and sealants for automotive, electronics, construction, and general industrial bonding. Additives help improve filler dispersion, rheology control, substrate wetting, and adhesion to metal and non-metal surfaces.
• Electronic Potting and Encapsulation — One-component epoxy systems for potting, encapsulation, and protection of electronic components, sensors, and power modules. Thermally conductive fillers and high filler loadings require efficient viscosity reduction, anti-settling, and defoaming.
• Composites — One-component epoxy matrices for composites, laminates, and prepregs where controlled viscosity, wetting, and foam-free processing are critical.
• Thermal Management — Thermally conductive epoxy systems for heat dissipation in electronics, LED modules, power supplies, and battery systems. KBS-F9100A and KBS-F8600 are particularly suitable for viscosity reduction and stability with thermally conductive fillers.
• Industrial Maintenance and Repair — One-component epoxy repair compounds, coatings, and sealants for equipment, pipelines, tanks, and structures exposed to chemicals, moisture, and mechanical stress.

About Our Company

As an innovative, collaborative, and trusted partner in the chemical industry, China AAB Industry Technology Group's Member Company has specialized in the R&D, production, and sales of high-performance additives since 2006.

Our additives are specifically designed for demanding coating, adhesive, and sealant systems. The product portfolio includes Wetting&Dispersing Agents, Thixotropic&Anti-Settling Agents, Defoamers, Wetting&Leveling Agents, Adhesion Promoters&Coupling Agents, Wax Additives, and Hand Feel Agents. These products are compatible with polyurethane, epoxy, acrylic, UV-curable, solvent-free, and high-solids resin systems.

For technical data sheets, samples, or customized recommendations for your specific one-component epoxy application, please contact our technical team.